The scaling of misorientation angle distribution at strain-induced boundaries in copper deformed by tension under various conditions

In the paper, polycrystalline copper deformed by tension under different conditions of loading has been studied using electron backscatter diffraction. The microstructure of areas located on the longitudinal section of the specimens deformed until fracture was examined. The fragmentation of initial grains in case of deformation at room temperature was observed whereas at 400°С, considerable dynamic recovery and recrystallization significantly influenced the microstructure formation. A procedure for computer analysis of the orientation maps has been put forward, which allows separating recrystallized regions from the non-recrystallized ones and further analyzing the misorientation statistics of strain-induced boundaries. A scaling behavior of the strain-induced misorientation distributions was shown to take place. The mechanism of strain-induced boundary evolution was proved to remain unchanged for all studied deformation conditions, in spite of recovery and recrystallization occurring at elevated temperatures.