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<!DOCTYPE article PUBLIC "-//NLM//DTD JATS (Z39.96) Journal Publishing DTD v1.3 20210610//EN" "https://jats.nlm.nih.gov/publishing/1.3/JATS-journalpublishing1-3.dtd">
<article article-type="meeting-report" dtd-version="1.3" xml:lang="ru">
  <front>
    <journal-meta>
      <journal-title-group>
        <journal-title>St. Petersburg Polytechnic University Journal: Physics and Mathematics</journal-title>
        <trans-title-group xml:lang="ru">
          <trans-title>Научно-технические ведомости СПбГПУ. Физико-математические науки</trans-title>
        </trans-title-group>
      </journal-title-group>
      <issn pub-type="epub">2304-9782, 2618-8686, 2405-7223</issn>
    </journal-meta>
    <article-meta>
      <article-id pub-id-type="publisher-id">55</article-id>
      <article-id pub-id-type="doi">10.18721/JPM.173.155</article-id>
      <title-group>
        <article-title>Low-temperature treatment of Al/Ti nanolayers to form solid solution in order to improve the ohmic contacts process formation</article-title>
        <trans-title-group xml:lang="ru">
          <trans-title>Низкотемпературная обработка нанослоев Al/Ti для формирования твердого раствора с целью улучшения процесса создания омических контактов</trans-title>
        </trans-title-group>
      </title-group>
      <contrib-group>
        <contrib contrib-type="author">
          <name>
            <surname>Nikitin</surname>
            <given-names>Konstantin</given-names>
          </name>
          <email>halkwww@mail.ru</email>
        </contrib>
        <contrib contrib-type="author">
          <name>
            <surname>Barsukov</surname>
            <given-names>Leonty</given-names>
          </name>
          <xref ref-type="aff" rid="aff1"/>
          <email>leonty.barsukov@gmail.com</email>
        </contrib>
        <contrib contrib-type="author">
          <name>
            <surname>Romashkin</surname>
            <given-names>Alexey</given-names>
          </name>
          <email>romaleval@gmail.com</email>
        </contrib>
        <contrib contrib-type="author">
          <contrib-id contrib-id-type="orcid">0000-0002-2976-9775</contrib-id>
          <name>
            <surname>Trifonov</surname>
            <given-names>Alexey</given-names>
          </name>
        </contrib>
        <contrib contrib-type="author">
          <contrib-id contrib-id-type="orcid">0000-0002-8578-3977</contrib-id>
          <name>
            <surname>Mozhchil</surname>
            <given-names>Rais</given-names>
          </name>
        </contrib>
        <contrib contrib-type="author">
          <contrib-id contrib-id-type="orcid">0009-0007-7675-3876</contrib-id>
          <name>
            <surname>Protasova</surname>
            <given-names>Svetlana</given-names>
          </name>
          <email>sveta@issp.ac.ru</email>
        </contrib>
      </contrib-group>
      <aff id="aff1">National Research University of Electronic Technology</aff>
      <pub-date publication-format="electronic" date-type="pub" iso-8601-date="2024-12-04">
        <day>04</day>
        <month>12</month>
        <year>2024</year>
      </pub-date>
      <volume>17</volume>
      <issue>3.1</issue>
      <fpage>271</fpage>
      <lpage>277</lpage>
      <abstract xml:lang="en">
        <p>Heat treatment of the Al, Al/Ti and Au/Ni/Al/Ti nanolayers at 450 °C was studied by measuring transparency, resistivity and also by SIMS (secondary ion mass spectrometry) and XPS (X-ray photoelectron spectroscopy). Heat  treatment has led to the increase in transparency and in resistivity of Al/Ti films. On the contrary, the same treatment for the pure Al layer decreases resistivity but transparency increases due to the decrease in the unoxidized Al  thickness. The upper Au/Ni layer has led to greater changes in resistivity and transparency but presumably due to a higher oxidation degree, that confirmed by XPS. Observed changes of the Al/Ti layer structure are assumed to be  explained not only by oxidation, but also by the partial formation of a Ti-Al solid solution, confirmed by SIMS (Ti and Al redistribution in the layer). The suppression of oxidation, Ti-Al formation temperature reduction and, as a result, possibility to improve GaN HEMT ohmic contacts with such layers were studied.</p>
      </abstract>
      <kwd-group xml:lang="en">
        <kwd>thin film</kwd>
        <kwd>rapid thermal annealing</kwd>
        <kwd>ohmic contact</kwd>
        <kwd>TiAl compounds</kwd>
        <kwd>transparency</kwd>
        <kwd>Raman spectroscopy</kwd>
        <kwd>SIMS</kwd>
        <kwd>XPS</kwd>
      </kwd-group>
    </article-meta>
  </front>
</article>
